Price:
$4.55

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For just $4.55 , buy Bumblebee Stencils IC Chip BGA Reballing Stencil Solder Template for iPhone XS/XS Max /XR from the wholesale webshop online.

Product Description

Bumblebee Stencils IC Chip BGA Reballing Stencil Solder Template for iPhone XS/XS Max /XR
  • Imported alloy steel, high-temperature resistant and wear-resistant

  • Designed specifically for mobile phone chips, it can make each solder ball round and full, meeting the needs of tin planting for various chips

  • Easy and quickly for reballing the BGA IC

  • Excellent to replace IC or BGA rework reballing

Compatible with:

  • iPhone XS/XS Max /XR

Package included:

  • 1 x Reballing Stencil

Specifications

Gross Weight 0.018kg
Volume Weight 0.005kg
Package Length 19.500cm
Package Width 12.000cm
Package Height 0.100cm
Package Weight 0.016kg
With Retail Packaging Yes
Bumblebee Stencils IC Chip BGA Reballing Stencil Solder Template for iPhone XS/XS Max /XR-1
Bumblebee Stencils IC Chip BGA Reballing Stencil Solder Template for iPhone XS/XS Max /XR-2

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